Enterprise-class SSD P8260 launched by UNIS, the controller, 3D Flash and DRAM inside are all made by UNIS

Some days ago, there was one rumor that UNIS had independently developed SSD hard disk with domestic NAND flash. However, according to the analysis, it is impossible to use domestic NAND flash to produce so called S100 series SSD launched by UNIS. As YMTC is unable to proceed mass production of good flash memory with stable performance and specification. 

However, YMTC storage does have a certain production capacity of 3D NAND flash memory. At the Seventh China Electronic Information Expo (CITE2019) in Shenzhen a few days ago, UNIS launched an enterprise-class P8260 solid-state hard disk. It uses the 32-layer stack 3D NAND flash supplied by the YMTC, the UNIS controller for SSD and the DRAM cache of by UNIS. So far, the three core chips of SSD have been made in China.

 
According to the information from UNIS, the P8260 SSD supports the NVMe 1.2.1 standard and PCIe 3.0 x4, and is available for 16 NAND channels, which provides the basis for high power. The dual-channel 40bit DDR controller (with ECC functionality) makes internal data access more reliable. The perfect combination of powerful hardware and efficient firmware can provide users with diversified, differentiated high performance, high reliability, and high stability characteristics of the enterprise SSD. The product has a strong competitiveness in the field of secure storage, and can provide an ideal customized choice for the needs of different users.

At present, the SSD P8260 from UNIS provides two capacities 1TB and 2TB, as well as AIC and U.2 interfaces for two types of products. 

From the official specification, the P8260 SSD uses 32-tier stack of 3D NAND flash memory stored in YMTC. The official did not mention the specific specifications, but the previous data released by the market can tell that the 32-tier NAND flash memory stored by the YMTC is 64Gb, which is the core capacity.

There is still a certain gap from the current mainstream products with the core capacity 256Gb and 512Gb, but the mass production from YMTC storage this year will be larger, which can be double to 128Gb from 64-layer stack 3D NAND flash memory core capacity, and then the gap will narrow. 

The main controller of the P8260 is Dera Storage; it is also produce enterprise storage solutions, and has its own enterprise main controller chip. However, the specification of the main controller chip is not released, their enterprise-class SSD is mainly NVMe SSD D5850/D5450/D5430 series.

DRAM Flash is the national core from Xi'an UNIS. We had introduced this company many times before. Its predecessor was QimondaAG Xi'an Company, which was gradually integrated and acquired by domestic companies, and finally incorporated by UNIS. This company is good at developing DDR3/DDR4 memory R & D, but they are not able to launch mass production. 
The DRAM Flash specification for the P8260 SSD is not released yet.

In addition to enterprise-class SSD, UNIS also present the SSD P5120 for the computer or PC pre-installed market, and also show SSD P100, S100 and related products for the consumer market. 

Among all the SSD, P100 and S100 adopt the world mainstream high-end storage wafer of UNIS storage partner; the characteristic of these products is mature and reliable technical solution, excellent working performance, smooth operation, power saving and durable. 

UNIS also provides users with up to three years of quality warranty, as well as very competitive market pricing, is bound to bring great surprises to the SSD market and users. 

With our previous analysis, the S100 family of SSD from UNIS can be determined that the NAND flash memory is not from YMTC, UNIS indicates that these products are using the world mainstream high-end storage wafers from his partner. 

UNIS had reached cooperation agreement with Intel last year. Intel has upgraded wafer factory in Dalian and can mass-produce 64-layer stack of 3D NAND flash memory. The flash memory for the consumer SSD from UNIS should take the purchase of Intel wafer that is self-encapsulated.