Intel and Micron have developed new 3D QLC Nand technology while single chip density reaching 1TB

Intel has announced cooperation with Micron to produce the first 3D QLC (4 bits/Cell) NAND technology in well-tested 64-layer architecture and new 4 bits/Cell 3D NAND technology, so density of each chip reaches 1TB which tends to replace mechanical hard disk, according to news on May 23th.
 
RV Giridhar, the vice president of Intel non-volatile memory technology developing, said, “1Tb 4bits/Cell NAND is a significant milestone of commercialize NVM history, what’s more, performance of floating gate 3D NAND technology is improved by large amounts of technologies and design innovation, in addition, moving to 4bits/cell will bring data center and client-side memory density and cost to a new operating point.”
The delivery of the third generation 3D NAND technology development in the end of 2018 or the beginning of 2019 said by Intel and Micron. Two companies have been agreed with developing 3D NAND independently after this technology node. In order to optimize technologies and products for their own service, it is predicted to realize mass production of Intel and Micron 96-layer 3D NAND in the second half of 2019.
As everyone knows, solid state disk has great advantages no matter in speed, power consumption or noise controlling compared with mechanical hard disk. It will gradually disappear in general consumption area after cheap solid state with large capacity being launched.