Because Apple, Qualcomm and Hisilicon are cutting down orders, TSMC may have overcapacity at 7 nm chips in the first half of 2019. However, TSMC will release various chips using 7 nm to improve this dilemma in 2019.
The lithography equipment system developed by Chinese Academy of Sciences to realize Chinese original technical innovation can produce 22nm chips by 365nm light, which will produce chips below 10nm with the help of multiple exposures in the future.
ASML suppliers Prodrive caught in a fire, resulting in the destruction of some production lines and inventory, contributes to delayed delivery in early 2019 but not 2018. TSMC and Samsung, instead of SMIC, have encountered large impacts for this case, but the loss is still depended on how much ASML is affected by the Prodrive fire.
TSMC tries to attract business in a rare consideration of cutting foundry prices. The price reduction focuses on mature technologies above 12nm and special technologies. As the saturation of 7nm process orders, there won’t be any decline of 7nm CPU and GPU prices.
There will be several top academic conferences in semiconductor area. The paper number of mainland China, Hongkong and Macao is up to 18 in ISSCC 2019, 9 papers of whom are from mainland China and one storage paper is selected for the first time.
There will be a negative growth of memory after supercycle according to WSTS. As semiconductor accounting for 21.2% of total export at present, Korea’s export growth rate will decline to 3% from 5.8% in next year.
The DWPD results of 1TB 860 QVO are similar to official. When SLC Cache runs out, the writing speed of 860 QVO 1TB is lower than 7200 rpm HDD if only 42GB SLC Cache runs out at the same time. The continuous write speed of 1TB 860 QVO is lower than HDD because the file size exceeds SLC Cache capacity.
Huang Chongren, the originator and CEO of Powerchip, said US Department of Justice prosecuted JHICC to block Chinese DRAM industry. Meanwhile, all of Samsung, SK Hynix and Micron no longer decided to expand production capacity. Thus, memory stockout was predicted to occur in the second half of next year.
Samsung officially released 860 QVO SSD, and it is Samsung’s first SSD, which uses QLC flash memory. Compared with similar products, its durability shows a decline, but it has a larger capacity and lower price.
SK Hynix will add $10 million investment and broaden the analog integrated circuits business in Wuxi China. The construction of 200mm wafer fab is prediced to finish in 2019.
