Goke Microelectronics recently released the 310/610 series based on China's first homegrown and self-developed SSD controller chip "GK2302 series." Powered by the homegrown processor Loongson, the SSDs can offer users a larger storage capacity, higher performance and a higher level of security, thus they are expected to determine the trend in China’s storage market in future.
SK hynix said on July 25th that it will cut production of NAND flash by 15% in 2019 compared with 2018 in response to Japanese export controls on. If the export controls become permanent, SK hynix cannot rule out the possibility of an impact on storage production.
Lu Zhiyuan analysis that the price is relatively stable-NOR price return to the stable and NAND price pick up some- because Macronix focus on cultivating high-density and high-quality products. With ROM, NOR, NAND particle shipment number increased in the third quarter, he is very confident about the future operation.
Japan imposed export curbs on three semiconductor materials vital to South Korean tech industry. The restrictions struck a blow at South Korean companies because the techniques required to make those materials are monopolized by Japan. Besides, it is hard for South Korea to figure out those techniques because the devices are hard to dismantle.
Japan imposed export curbs on three semiconductor materials vital to South Korean tech industry. The restrictions struck a blow at South Korean companies because the techniques required to make those materials are monopolized by Japan. Besides, it is hard for South Korea to figure out those techniques because the devices are hard to dismantle.
The impact of the trade war between Japan and South Korea is so great that the price of 8GB DRAM has increased by 23% since July. Samsung intend to build a hydrogen fluoride plant in South Korea to cope with Japan’s export restrictions.
Japanese and Korean semiconductor companies are mutually dependent. The conflict between Japan and Korea highlight the difficulties the semiconductor materials industry face in 2019.
Advanced packaging has become the best choice for high-performance chips. In the field of advanced packaging, the current major competition is between TSMC and Intel. TSMC and Intel have their own advantages.
Japan's restrictions on the exports of semiconductor materials to South Korea have already hit the South Korean chip manufacturers seriously, owing to Japan’s monopoly on semiconductors. If Japan expands the curbs further to other core materials used during the EUV lithography process, it will jeopardize the prospects of Samsung’s EUV lithography and even threaten its status as the industry leader...
UNISOC launched its AIoT chip solutions based on PSA, which can deliver excellent user experience to both users and developers, thanks to their outstanding computing performance and connectivity. The solutions will play an important role in underpinning the IoT development.
